LAUFFER plastic and enveloping technology has been a worldwide term for the processing of thermosets and the encapsulation of semiconductor components, electronic assemblies and components for 50 years. Our range of products ranges from thermosetting presses, manually loaded transfer molding presses to fully automatic wrapping systems.
- Unsaturated polyester resins
- High rigidity
- Low flow-orientation with benefit of less warpage and tension
- High-quality surface
- Same shrinkage behaviour in all directions
- No runner system required, thus an easy design of multi-cavity molds is possible
- Low mold cost, less wear